The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm.
Analysis of small chip level components down to 28 μm
Hands-free operation for simultaneous testing and IR imaging
Exchangeable, focusable lenses for most flexible use of the camera
Exhibitor: Optris GmbH