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Microscope optics for the inspection of electronic boards

The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the
camera can vary between 80 and 100 mm.

Important specifications

Analysis of small chip level components down to 28 μm

Hands-free operation for simultaneous testing and IR imaging

Exchangeable, focusable lenses for most flexible use of the camera

Further reading

Exhibitor: Optris GmbH


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